ATP Public
Meeting Announcement
Semiconductor Lithography
January
30, 1998, 9:00 am 5:00 pm
Hyatt Regency San Antonio
123 Losoya Street
San Antonio, TX 78205
About the Advanced Technology
Program
NIST's Advanced
Technology Program (ATP) provides competitive, cost-shared awards for
industry to develop high-risk, enabling technologies with broad-based
economic benefit. ATP seeks to help industry fill the gap between basic
research and product development, and to invest in technology that would
not be developed in a competitive time frame without government cost-sharing.
Along with general competitions, which are open to proposals from all
technical areas, ATP is also funding a series of "focused programs" with
specific business and technical goals.
Background
The continuing reduction
in cost per function in the semiconductor industry has been driven largely
by reduction in feature sizes, which in turn has been possible through
advances in semiconductor lithography.
Optical lithography
has been the technology of the semiconductor industry for more than 30
years. This technology is expected to take the semiconductor feature sizes
down to 0.18 micron and maybe down to 0.13 micron. To achieve smaller
feature sizes, the semiconductor industry will need other imaging technologies.
The lithography equipment
market is at present dominated by foreign firms. To establish themselves
as market leaders for lithography equipment for the next generation and
beyond, U.S. companies have to dominate in the post-deep UV lithography
technologies.
In order to meet the
needs of the industry, research on new imaging technologies is under way
in several laboratories around the world. The technologies include X-Ray
Lithography, Extreme Ultraviolet Lithography, Electron Beam Lithography,
and Ion Beam lithography. A preferred technology area may not emerge until
late 1999.
Each of these alternative
technologies, however, needs several common technologies that will support
future semiconductor lithography. These include mask technologies, resist
technologies, optical element fabrication technologies, metrology, alignment
systems, safety, etc. An ATP focused program could address these common
needs of the semiconductor lithography industry for < = 0.13 µm
geometries for 2003 and beyond.
Purpose
The
purpose of this workshop is to discuss how ATP can best address the
needs of the Semiconductor Lithography industry. ATP has obtained valuable
information about the requirements and goals of this industry through
white papers submitted to ATP and a workshop held on November 20, 1997
in San Francisco, CA.
Based
on evaluation of this information, ATP has determined that the immediate
needs of the industry can, at least partially, be met by the Focused
Program Competition 98-06 on "Microelectronics Manufacturing Infrastructure
(MMI)" and the General Competition 98-01. Proposals for the MMI program
are due on April 8, 1998 and proposals
for the General Competition are due on March 18,
1998. The project selection criteria for these two competitions
will be discussed in the workshop.
ATP
is also evaluating the need for a focused program devoted exclusively
to semiconductor lithography. The general consensus among participants
at the ATP workshop held on November 20, 1997,
was that a focused program should encompass the common technologies
supporting multiple potential future imaging technologies: EUV, X-ray,
Ion-Beam, E-Beam direct write, and SCALPEL.
The
January workshop is expected to provide a clear definition of the scope
of a potential focused program and answers to how such a program meets
ATP's program selection criteria.
Representatives
from the lithography community, including equipment companies, user
companies, technical and trade associations, academic institutions,
non-profit research institutions, and government laboratories are invited
to participate in this meeting.
Agenda
| 8:00-8:05
|
Welcome
and Review Agenda |
| 8:05-8:20
|
Overview
of ATP and Example of a Focused Program |
| 8:20-10:30
|
Semiconductor
Lithography Focused Program Definition (Discussion on Selection
Criteria and Scope of Program) |
| 10:30-11:00
|
Break
|
| 11:00-11:30
|
Wrap-up
on semiconductor Lithography Focused Program (Action Items) |
| 11:30-1:00
|
Mini-Proposer's
Conference for Microelectronics Manufacturing Infrastructure Focused
Program (Discussion on Scope, Proposal Guidelines, Project Selection
Criteria, etc.) |
Contacts
Michael
Schen
Group Leader, Electronics & Photonics
Information Technology & Electronics Office
Advanced Technology Program
NIST
Tel: 301-975-3543
Fax: 301-926-9524
e-mail: michael.schen@nist.gov
| Dr.
Purabi Mazumdar
Program Manager
Information Technology & Electronics Office
Advanced Technology Program
NIST
Tel: 301-975-4891
Fax: 301-926-9524
e-mail: purabi.mazumdar@nist.gov
|
Date
created: December 1997
Last updated:
April 29, 2003
|
