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Microelectronics Manufacturing Infrastructure (MMI) Photonics Manufacturing: Results, Challenges and Opportunities Supporting Technologies for Semiconductor Lithography Advanced Wireless Communications: Are We Ready?
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Microelectronics Manufacturing Infrastructure (MMI) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Monday, November 15, 1999 | |
| 9:30 a.m. | Welcome
Cita Furlani, Acting Director, ATP |
| 9:35 a.m. | "ATP
and Microelectronics Manufacturing Update"  Michael Schen, Program Manager, ATP |
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Future Challenges and Opportunities Panel Presentations and Discussion Dr. Martin Giles, Intel Corporation Dr. James Briguglio, DII/Multek Dr. Srinivas Rao, Solectron Corporation Dr. James Hutchby, Semiconductor Research Coroproation Mr. James McElroy, National Electronics Manufacturing Initiative (NEMI) Mr. Marshall Andrews, Interconnection Technology Research Institute (ITRI) | |
| 10:00 a.m. | "Front-end
Semiconductor Modeling, Simulation, Design and Manufacturing"
Dr. Martin Giles, Intel Corporation |
| 10:45 a.m. Coffee Break | |
| 11:00 a.m. | "HDI
Materials With Higher Tg" Dr. James Griguglio, DII/Multek |
| 11:45 a.m. |
Back-end TIM, Manufacturing, and Environmentally Sustainable Electronics Dr. Srinivas Rao, Solectron Corporation |
| 12:30 p.m. Lunch | |
| Industry Perspectives and ATP Musings | |
| 2:00 p.m. |
Preparing a Competitive Proposal: Views from a Recent Awardee Dr. Yun Zhang, Lucent Technologies, Electroplating Chemicals and Services |
| 2:15 p.m. |
Reviewing Industry’s Proposals: What’s Needed to Succeed? Purabi Mazumdar, ATP |
| 2:30 p.m. |
Discussion/Synthesis of MMI "Sweet Spots" |
| 3:15 p.m. Coffee Break | |
| Microelectronics Manufacturing Project Briefings I: | |
| 3:30 p.m. | Introductory Comments |
| 3:35 p.m. | Critical
Components for Process Control in Microelectronics Manufacturing
Dr. Peter Solomon, On-Line Technologies, Inc. |
| 3:55 p.m. | Gas-cluster
Ion-beam Manufacturing Tool for Next-generation Semiconductor Devices
Dr. David J. Fenner, Epion Corporation |
| 4:15 p.m. |
Agent-enhanced Manufacturing System Initiative Alan Weber, Object Space, Inc. |
| 4:35 p.m. |
Integrated Control of the Semiconductor Patterning Process Dr. Matthew Hankinson, KLA-Tencor Corporation |
| 4:55 p.m. | Closing Comments |
| 5:00 p.m. | Concludes Day 1 |
| Tuesday, November 16, 1999 | |
| 8:25 a.m. | Day 2 Goals & Administrative Remarks |
| 8:30 a.m. |
NIST Measurements R&D for Microelectronics Manufacturing Stephen Knight, Director, NIST National Semiconductor Metrology Program |
| Microelectronics Manufacturing Project Briefings II | |
| 9:00 a.m. |
Ultra-low Dielectric Constant Materials for Integrated Circuit Interconnects Dr. Steve Martin, Dow Chemical Co. |
| 9:20 a.m. |
Integrated GMR Isolated Devices and Planar Transformers Dr. Ty Fayfield, Nonvolatile Electronics, Inc. |
| 9:40 a.m. |
Membrane Probes for Wafer, Package, and Substrate Testing Ken Smith, Cascade Microtech, Inc. |
| 10:00 a.m. |
Wafer-scale Applied Reworkable Fluxing Underfill for Direct Chip Attach Marc Chason, Motorola, Inc. |
| 10:20 a.m. | Coffee Break / Poster Session: ATP Funded Measurements R&D for Microelectronics Manufacturing |
| 11:20 a.m. |
Micro-contact Springs for High-performance Probing and Packaging Dr. David Fork, Xerox PARC |
| 11:40 a.m. |
Novel High-performance Wafer-level Reworkable Underfill Materials for Flip-chip Packaging Dr. Quinn Tong, National Starch and Chemical Co. |
| 12:00 p.m. |
Advanced Embedded Passives Technology Dr. Goran Matijasevic, Ormet Co., Advanced Embedded Passives Technology Consortium |
| 12:20 p.m. Wrap Up / Action Items | |
| 12:30 p.m. | Adjourn |
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